[News] Can Global Fab Expansion Keep Up with Micron’s HBM Surge? Timeline Update from U.S., Japan & India

Micron’s record-breaking revenue in Q3 FY2025 was driven by a nearly 50% surge in HBM sales—and the momentum isn’t slowing. The U.S. memory giant now aims for a roughly 25% share of the HBM market by year-end, as noted by ZDNet. While its upbeat outlook draws market attention, the spotlight is also on whether its global capacity expansion can keep pace. Here’s a quick look at Micron’s latest manufacturing moves, both at home and overseas.

U.S. Production Timeline Points to 2027 Start

In September 2022, Micron unveiled a $15 billion plan to expand its Boise, Idaho headquarters with a cutting-edge R&D and semiconductor manufacturing facility—the first memory fab built in the U.S. in over 20 years, as per its press release.

During its June 25 earnings call, Micron revealed that its first Idaho fab, ID1, hit a major construction milestone in June. DRAM wafer production is set to begin in the second half of 2027, with customer qualifications to follow, Micron said.

Just weeks earlier, on June 12, the U.S. memory giant unveiled a $200 billion expansion plan to boost domestic manufacturing, which includes a second fab in Boise. This new facility, ID2, is expected to begin production ahead of its first New York fab, according to Micron.

However, its $100 billion mega fab project in New York, announced back in 2022, has faced repeated delays. Citing syracuse.com, The daily orange reports that groundbreaking is now delayed to late November or December 2025—well behind the original June 2024 target. The company says site prep will begin later this year, pending environmental approvals.

Micron states that ground preparation for the New York site is slated to begin later this year, pending completion of state and federal environmental reviews.

Hiroshima Plant on Track for 2026 Production

On the other hand, Micron’s new plant in Hiroshima Prefecture, Japan, is progressing smoothly. According to Nikkei, Micron now aims to begin mass production of next-gen DRAM at its Hiroshima plant in 2026.

Notably, Nikkei reports that Micron plans to install an EUV (extreme ultraviolet) system in its fab by June. While Rapidus has set up an EUV system for testing, Micron’s installation would be Japan’s first for mass production, the report adds.

India Plant Operational by 2H25

Meanwhile, construction of Micron’s assembly, testing, marking, and packaging (ATMP) plant in India, is speeding up. The facility, focused on turning wafers into ball grid array (BGA) integrated circuit packages, memory modules, and solid-state drives, is nearing cleanroom validation, with Phase 1 expected to be operational by the second half of 2025, according to the the Economic Times.

The US memory chip maker plans to invest up to $825 million across two project phases in India, with total funding—including government support—reaching $2.75 billion, the report indicates.

Micron expects Phase 2 of the project, which would include construction of a facility similar in scale to Phase 1, to start towards the second half of the decade, as per its press release.

Read more

• [News] Micron’s $100B Mega Fab Reportedly Delays Again, with Groundbreaking Pushed to Late 2025
• [News] Micron to Invest $200B in U.S. Amid Trump’s Reshoring Drive, Targeting 40% DRAM Made in America

(Photo credit: Micron)