Articles


2025-05-09

[News] TSMC’s April Sales Hit Record on Tariff Rush, but Currency Gains Cloud Outlook

TSMC announced today (May 9) that its consolidated revenue for April 2025 reached approximately NTD 349.57 billion (about USD 11.6 billion), up 22.2% from March 2025 and 48.1% higher than April 2024. Its April revenue surpassed the previous record high of NTD 314.24 billion set in October 2024, m...

2025-05-09

[News] NVIDIA Reportedly Prepares Toned-down Version for H20, Set for July Release

With CEO Jensen Huang calling it a “tremendous loss” to be blocked from China’s AI market, NVIDIA is gearing up to launch a toned-down version of its H20 AI chip for China as early as July, according to Reuters. The report says Team Green has already given major Chinese cloud providers a he...

2025-05-09

[News] Apple Reportedly Plans Smart Glasses Chip by Late 2026, First AI Server Chip by 2027

Apple is reportedly making progress on a custom chip for its smart glasses, with mass production expected by the end of next year or in 2027, according to Bloomberg. If development stays on track, the glasses could launch in the next two years. As with Apple’s other key chips, manufacturing will ...

2025-05-09

[News] SMIC’s U.S. Revenue Share Climbs to Nearly 13% in Q1; Warns of 4–6% Q2 Sales Dip

Amid looming chip tariffs, China’s leading foundry SMIC delivered a robust 161.9% year-on-year surge in Q1 profit, hitting $188 million, as highlighted by Reuters and China’s Wallstreetcn. Despite the strong start, the company struck a cautious tone for Q2, projecting a 4–6% Q2 sales dip and a...

2025-05-09

[News] New-Generation of 3D X-DRAM Unveiled: Aiming to Boost DRAM Bit Density by 10x

On May 7, NEO Semiconductor announced a major breakthrough in its 3D X-DRAM technology series: the industry’s first 3D X-DRAM cell structures based on 1T1C and 3T0C architectures. According to NEO Semiconductor, the new technology is designed to deliver unprecedented density, power efficiency, ...

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